The programme curriculum which has been designed is aimed to render the needs of knowledgeable highly skilled engineers in parallel with Malaysian National Industrial Master Plan aspiration. The programme focuses on industrial exposure, through direct involvement with the industrial sector. This four years programme emphasizes on integrated circuit (IC) design and IC fabrication, which include semiconductor technology, microfabrication process technology, microelectronic reliability and failure analysis. In addition, the programme also covers semiconductor physics, Micro-Electro-Mechanical System (MEMS) as well as IC packaging
Fields versus Skills
There is a high demand for highly skilled microelectronic engineers, both in the private sector as well as in the government, especially in IC design, fabrication and testing. Career prospect for the graduates are very promising.
Among the fields that may be ventured into by the graduates are:
- Semiconductor / Microelectronic Fabrication
- Fully embedded and Partial embedded Layout Design for digital, analogue, combination signal and RF-IC chips.
- Mask Design
- Application Specific ICs (ASICs) and Very Large Scale Integration (VLSI)
- MEMS Design
- Photonics Design
- VHDL-based Design
- Rapid Prototyping equipments for IC Production
- Process and Devices Simulation
- IC Packaging
- Reverse Engineering on ICs